Zhen Ding Technology has been granted a patent for a method of manufacturing a circuit board. The method involves providing single-sided circuit substrates, forming conductive posts, providing adhesive layers, defining receiving grooves, mounting electronic components, stacking the substrates in a specific order, and pressing the intermediate body to obtain the final circuit board. GlobalData’s report on Zhen Ding Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Zhen Ding Technology, Under-screen biometric identification was a key innovation area identified from patents. Zhen Ding Technology's grant share as of September 2023 was 50%. Grant share is based on the ratio of number of grants to total number of patents.
Method for manufacturing a circuit board with conductive posts
A recently granted patent (Publication Number: US11778752B2) describes a method for manufacturing a circuit board. The method involves several steps to create a circuit board with improved electrical connections and structural integrity.
The method begins by providing a single-sided circuit substrate, which consists of an insulating base layer and a circuit layer. The circuit layer is then electrically connected to a plurality of first conductive posts embedded in the insulating base layer, resulting in a second single-sided circuit substrate. A first adhesive layer is applied, and a plurality of second conductive posts are formed within the adhesive layer.
Next, a third single-sided circuit substrate is created by defining a receiving groove that penetrates the circuit layer and the insulating base layer of the second single-sided circuit substrate. An electronic component is mounted on another single-sided circuit substrate, resulting in a surface-mounted circuit substrate. The first single-sided circuit substrate, the first adhesive layer with second conductive posts, the second single-sided circuit substrate, at least one third single-sided circuit substrate, and the surface-mounted circuit substrate are then stacked in order, aligning the receiving groove with the electronic component.
The stacked substrates are pressed together, causing the first and second conductive posts to electrically connect to both sides of the circuit layer. This creates an intermediate body, which is then further processed. In one embodiment, openings are defined in the insulating base layer to expose portions of the circuit layer, forming solder pads. A surface treatment is then performed on the solder pads.
The patent also describes variations of the method depending on the materials used. For example, if the insulating base layer is made of a thermoplastic polymer resin, the pressing is performed at a heating temperature to allow the first adhesive layer to fill gaps in the circuit layer and the insulating base layer. If a non-thermoplastic polymer resin is used, a second adhesive layer is added to fill the gaps.
Overall, this patented method offers a comprehensive approach to manufacturing circuit boards with improved electrical connections and structural integrity. The method can be adapted to different materials and provides flexibility in the design and assembly of circuit boards.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
