Global Foundries had eight patents in advanced materials during Q1 2024. Global Foundries Inc filed patents in Q1 2024 related to photonic integrated circuit (PIC) structures with optical guard elements, structures with optical components and features for thermal management, and waveguide structures with metamaterial structures for reducing insertion loss and crosstalk. GlobalData’s report on Global Foundries gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Global Foundries grant share with advanced materials as a theme is 50% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Photonic integrated circuit including plurality of discrete optical guard elements (Patent ID: US20240094465A1)
The patent filed by Global Foundries Inc. describes a photonic integrated circuit (PIC) structure that includes a photonic component on a semiconductor substrate surrounded by multiple optical guard elements made of light-absorbing materials. These guard elements can mimic the outer periphery of the photonic component and may consist of materials like germanium, silicon with high dopant concentration, or polysilicon. The arrangement of these guard elements can vary in shape and spacing, with some embodiments featuring multiple horizontal cross-sectional shapes and non-uniform spacing along the periphery of the photonic component.
Furthermore, the patent details methods for forming these PIC structures, including the specific materials and configurations used for the optical guard elements. The process involves creating a photonic component on a semiconductor substrate and then forming the discrete optical guard elements around it. These guard elements can be composed of a metamaterial containing silicon or germanium and are arranged to mimic the outer periphery of the photonic component. The method allows for flexibility in the design and layout of the guard elements, enabling customization based on the specific requirements of the PIC structure being developed.
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