IBIDEN has been granted a patent for a method of manufacturing printed wiring boards. The process involves creating through holes in a copper-clad plate, applying an electrolytic plating film, masking specific regions, and etching to form a conductor circuit, optimizing both high-density and low-density areas. GlobalData’s report on IBIDEN gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on IBIDEN, Diesel Particulate Filters (DPF) was a key innovation area identified from patents. IBIDEN's grant share as of July 2024 was 40%. Grant share is based on the ratio of number of grants to total number of patents.
Method for manufacturing printed wiring boards with varied hole density
The patent US12058818B2 outlines a method for manufacturing a printed wiring board (PWB) that involves several key steps to enhance the efficiency and quality of the board. The process begins with the formation of through holes in a double-sided copper-clad laminated plate, creating both high-density and low-density regions. An electrolytic plating film is then applied to the copper foil in these regions. A masking resist is placed over the high-density region to protect it during the etching process, which thins the electrolytic plating film in the low-density region. After removing the masking resist, a conductor circuit is formed that integrates the copper foil and the electrolytic plating film across both regions.
Further enhancements to the manufacturing method include filling cavities within the electrolytic plating film with a filler material, which can be an epoxy resin, magnetic material, or inorganic filler. The surface of the electrolytic plating film is then polished to achieve a flattened finish, ensuring uniformity across the high-density and low-density regions. Additionally, a cover plating conductor may be applied over the filled through holes. The conductor circuit can be formed using either a subtractive or semi-additive method, providing flexibility in the manufacturing process. This patent presents a comprehensive approach to improving the structural integrity and performance of printed wiring boards through innovative manufacturing techniques.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
