Infineon Technologies had two patents in mobile during Q2 2024. Infineon Technologies AG filed a patent for a fan-out wafer-level package containing a magnetic field sensor chip, encapsulation material, external electrical contact element, and electrical redistribution layer. Another patent filed by the company involves a method for attestation of a hardware wallet on a blockchain, using smart contracts to verify the hardware wallet’s certification and capabilities. GlobalData’s report on Infineon Technologies gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Infineon Technologies had no grants in mobile as a theme in Q2 2024.
Recent Patents
Application: Fan-out wafer-level packages and associated production methods (Patent ID: US20240196757A1)
The patent filed by Infineon Technologies AG describes a fan-out wafer-level package containing a magnetic field sensor chip encapsulated by an encapsulation material. The package also includes an external electrical contact element made of a planar solderable metal coating and an electrical redistribution layer that connects the sensor chip to the contact element. The package is designed to be thin, with the contact element being less than 20 micrometers thick and the overall package thickness less than 250 micrometers.
The claims detail various aspects of the fan-out wafer-level package, including the composition of the magnetic field sensor chip, the materials used for the planar solderable metal coating, and the configuration of the electrical redistribution layer. The method for producing the package involves forming, dividing, encapsulating, and creating the necessary layers on the semiconductor wafer before dividing it into individual fan-out wafer-level packages. Additional steps such as thinning the wafer, arranging protection layers, forming a plastics layer, and creating a solder mask are also included in the production process. The method emphasizes the use of low-temperature processes for forming the solder mask to ensure the integrity of the package during production.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
