Infineon Technologies had five patents in quantum computing during Q2 2024. Infineon Technologies AG filed a patent for a method of manufacturing an electronic device that involves generating a superconducting electronic circuit on a substrate. Metal oxides from the circuit’s metal surfaces are removed in an oxygen-free environment, and the circuit is then covered in situ with hermetic encapsulation for protection. GlobalData’s report on Infineon Technologies gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Infineon Technologies had no grants in quantum computing as a theme in Q2 2024.
Recent Patents
Application: Electronic device including a superconducting electronic circuit (Patent ID: US20240147871A1)
The patent filed by Infineon Technologies AG describes a method for manufacturing an electronic device with a superconducting electronic circuit. The process involves generating the circuit on a substrate, removing metal oxides from the circuit in an oxygen-free environment, and encapsulating at least a portion of the circuit hermetically. Various techniques such as plasma etching, HF vapor application, or wet etching can be used to remove the metal oxides. The method also includes steps for creating a hermetically sealed hollow space using a lid wafer and sacrificial material.
The electronic device resulting from this method includes a substrate, a superconducting electronic circuit, and a hermetically sealed lid enclosing a portion of the circuit. The thickness of metal oxides on the enclosed portion is minimal, and the circuit can include components like resonating circuits, readout circuitry, Josephson junctions, and resonating circuit capacitors. Additionally, the device may feature multiple superconducting circuits with corresponding hermetically sealed lids arranged in layers. The innovative manufacturing process ensures the reliability and performance of the superconducting electronic device.
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