Intel. has filed a patent for electronic packages and fabrication methods. The package includes an interposer with a cavity holding a nested component, connected to a die with interconnects. The claim details a package with mold layers, a bridge, passive components, dies, redistribution layers, and a second mold layer. GlobalData’s report on Intel gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Intel, Device power optimization was a key innovation area identified from patents. Intel's grant share as of January 2024 was 58%. Grant share is based on the ratio of number of grants to total number of patents.
Electronic package with bridge, dies, and passive components
A recently filed patent (Publication Number: US20240038687A1) describes an electronics package that includes a first mold layer with a bridge embedded in it, featuring through component vias. The package also contains a passive component, such as a capacitor, inductor, or resistor, laterally spaced apart from the bridge. Two dies are positioned over different portions of the bridge, with a redistribution layer between the bridge and each die. A second mold layer is located between the two dies, providing a comprehensive structure for electronic components to be housed securely.
Additionally, the patent outlines a method for fabricating such an electronics package, involving embedding a bridge in a mold layer, positioning a passive component laterally from the bridge, and placing two dies over different portions of the bridge. The method includes forming redistribution layers between the bridge and each die, as well as a second mold layer between the dies. This innovative approach to electronics packaging aims to enhance the efficiency and reliability of electronic devices by providing a structured and secure environment for components, ensuring optimal performance and longevity.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
