KLA’s patented method involves using two detectors with varying imaging parameters to capture images of a semiconductor wafer, analyzing center-of-symmetry variations, and generating a recipe for metrology measurements. The optical apparatus includes an illumination assembly and imaging assembly controlled by a processor. GlobalData’s report on KLA gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on KLA, Defect detection models was a key innovation area identified from patents. KLA's grant share as of May 2024 was 47%. Grant share is based on the ratio of number of grants to total number of patents.
Optical apparatus for semiconductor wafer metrology with varied imaging parameters
A recently granted patent (Publication Number: US12001148B2) discloses an optical apparatus designed for semiconductor wafer imaging and metrology. The apparatus includes an illumination assembly directing beams to the wafer and an imaging assembly with two detectors capturing images with different parameters. A controller processes the images to assess center of symmetry (COS) variations of target features, identifying optimal imaging parameter values for metrology measurements. The apparatus can calibrate measurements based on COS variations and perform overlay measurements, utilizing varied parameters like focal position, wavelength, and polarization for imaging optimization.
Furthermore, the patent details a method for generating images of a semiconductor wafer using varied imaging parameters to analyze COS variations of target features. The method involves identifying optimal parameter values for metrology measurements, calibrating measurements based on COS variations, and performing overlay measurements. By projecting grating images onto detectors and registering images based on these projections, the method ensures accurate and precise metrology measurements. Additionally, the method evaluates asymmetry of features on the wafer to further enhance imaging and measurement accuracy. Overall, this patent introduces an innovative approach to semiconductor wafer imaging and metrology, offering a comprehensive solution for optimizing measurement accuracy and precision in semiconductor manufacturing processes.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
