LG Display has patented a method for manufacturing a circuit board with a unique structure. The board includes an insulating layer, circuit layer, and top metal layer with specific dimensions and materials. This innovation allows for improved performance and efficiency in electronic devices. GlobalData’s report on LG Display gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on LG Display, Under-screen fingerprint recognition was a key innovation area identified from patents. LG Display's grant share as of January 2024 was 55%. Grant share is based on the ratio of number of grants to total number of patents.
Circuit board with top metal layer having extended portion
A recently granted patent (Publication Number: US11889634B2) discloses a circuit board design comprising an insulating layer, a circuit layer, and a top metal layer. The circuit layer includes a portion positioned higher than the insulating layer, with the top metal layer covering this portion. The top metal layer is made of gold or a gold alloy and includes a first portion in direct contact with the circuit layer and a second portion extending outwards. The circuit layer consists of two layers of the same metal material, with the second layer's thickness ranging from 1 um to 13 um. The top metal layer's width is greater than the circuit layer's width, and the first layer of the circuit layer has a convex portion while the second layer has a concave portion with respect to the insulating layer.
Furthermore, the patent also covers a semiconductor package design with similar features, including an insulating layer, a circuit layer positioned higher than the insulating layer, and a top metal layer made of gold or a gold alloy. The top metal layer has a first portion in direct contact with the circuit layer and a second portion that does not overlap with the circuit layer. The circuit layer consists of two layers of the same metal material, with the first layer thicker than the second layer. The top metal layer's width exceeds that of the circuit layer, and the first layer's convex portion directly contacts the second layer's concave portion. The design allows for a semiconductor device to be connected to the top metal layer through solder ball or wire bonding, enhancing the overall functionality of the semiconductor package.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
