Microchip Technology has been granted a patent for a metal-insulator-metal (MIM) capacitor module. The innovative design includes a bottom electrode cup, insulator with a rounded flange, and a top electrode with a planarized surface and connection pad. This technology enhances capacitor performance and reliability. GlobalData’s report on Microchip Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Microchip Technology, Adaptive video coding was a key innovation area identified from patents. Microchip Technology's grant share as of May 2024 was 44%. Grant share is based on the ratio of number of grants to total number of patents.
Metal-insulator-metal capacitor module with planarized top electrode connection pad
A metal-insulator-metal (MIM) capacitor module has been granted a patent (Publication Number: US12015052B2) that includes a bottom electrode cup with a base and sidewall, an insulator cup with a rounded insulator flange, and a top electrode insulated by the rounded insulator flange. The top electrode features a planarized top surface with a connection pad fully covering it. The module also includes a bottom electrode base, contact, and connection pad, with different layers of metal used for various components. The insulator cup has a sidewall with multiple segments, and the top electrode connection pad fully covers the insulator, providing a compact and efficient design for integrated circuits.
Furthermore, an integrated circuit structure incorporating the MIM capacitor module has been patented, featuring an interconnect structure with lower and upper elements connected by an interconnect via. The structure includes a common dielectric region where the bottom electrode cup and interconnect via are formed. The top electrode in the module has a cap region adjacent to the rounded insulator flange, and the bottom electrode cup and interconnect via are made from a common conformal metal. The structure also includes a bottom electrode base, contact, and connection pad, with different metal layers used for various elements. This patented design offers a comprehensive and integrated solution for efficient circuit structures with improved performance and functionality.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
