Micron Technology. has been granted a patent for a computing system that optimizes memory module placement based on thermal characteristics. The system features memory slots with varying temperatures, enhancing performance by aligning memory modules to cooler or hotter regions, thereby improving operational efficiency under different temperature conditions. GlobalData’s report on Micron Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Micron Technology, 3D memory devices was a key innovation area identified from patents. Micron Technology's grant share as of July 2024 was 68%. Grant share is based on the ratio of number of grants to total number of patents.
Memory module placement based on thermal performance characteristics
The granted patent US12073108B2 describes a computing system featuring a substrate with two memory slots, each divided into regions that exhibit varying temperature profiles during operation. The first memory slot consists of a first and second region, which are cooler than the third and fourth regions of the second memory slot. Each memory module installed in these slots has distinct performance ratings that are influenced by temperature. Specifically, the first memory module's performance ratings are aligned with the cooler regions, while the second memory module is designed to operate more effectively at higher temperatures, with its performance ratings corresponding to the hotter regions of the second memory slot.
The patent further details the alignment of channels within the memory modules to their respective regions in the slots, emphasizing that the second channel of both memory modules operates more efficiently at elevated temperatures. Additionally, the system allows for the identification of the coolest and hottest memory slots based on their operational temperatures, which can guide the placement of memory modules to optimize performance. The claims also suggest the potential for additional memory modules and slots, each with varying temperature sensitivities, thereby enhancing the adaptability of the computing system to different operational conditions. The performance ratings can be determined through methods such as power consumption analysis or using a ring oscillator, providing a systematic approach to managing temperature effects on memory performance.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
