NEC had 14 patents in quantum computing during Q2 2024. Description: The patent filed by NEC Corp in Q2 2024 describes a quantum device consisting of two chips assembled to create a three-dimensional wiring structure. The first chip has a protruding region with terminals, extending from the outer periphery of the second chip. GlobalData’s report on NEC gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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NEC had no grants in quantum computing as a theme in Q2 2024.

Recent Patents

Application: Quantum device (Patent ID: US20240160982A1)

The patent filed by NEC Corp describes a quantum device consisting of two chips assembled to create a three-dimensional wiring structure. The first chip includes a protruding region with terminals for testing purposes. The second chip may contain a circuit under test connected to the terminals on the first chip for testing. Various configurations and arrangements of the chips and circuits are detailed in the claims, including the use of external connection terminals, circuit elements on different surfaces of the chips, and specific arrangements for testing different components of the quantum device.

Overall, the patent outlines a novel quantum device design that allows for efficient testing and integration of superconducting quantum circuits in a three-dimensional structure. The use of protruding regions with terminals for testing purposes, along with specific arrangements of circuit elements on different surfaces of the chips, enables effective testing and connection of various components within the quantum device. The detailed claims provide specific configurations and arrangements for implementing the quantum device, highlighting the innovative approach taken by NEC Corp in developing this technology.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.