Nova has been granted a patent for a method to determine properties of a layer in integrated circuits. The process involves irradiating the IC, collecting emitted electrons, and analyzing their kinetic energy to calculate emission intensity ratios, which help ascertain the layer’s material composition or thickness. GlobalData’s report on Nova gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Nova, Pose estimation was a key innovation area identified from patents. Nova's grant share as of July 2024 was 49%. Grant share is based on the ratio of number of grants to total number of patents.
Method for analyzing integrated circuit layer properties
The patent US12066391B2 outlines a method for determining properties of a layer in an integrated circuit (IC) that is situated over an underlayer. The process begins with the irradiation of the IC's non-flat topology, which generates emissions from the IC. The emitted species' kinetic energy is then analyzed to calculate the emission intensity from both the layer and the underlayer. A ratio of these intensities is established, and measurements from an optical critical dimension (OCD) tool are utilized to create a model of the IC's repetitive pattern. This ratio, combined with the model, aids in determining the material composition or thickness of the layer.
The method can employ techniques such as x-ray photoelectron spectroscopy (XPS) or x-ray fluorescence spectroscopy (XRF) for the emission collection. When using XPS, the process may involve concurrent or iterative spectrum interpretation to refine the extraction of thin film layers. The method also includes calculating predictive intensity functions based on the layer's thickness and utilizing calibration coefficients to normalize the kinetic energy of emitted species. Additionally, the non-flat topology can be modeled as a repetitive fin structure, with emission contributions calculated from various parts of the fin. Overall, the method provides a comprehensive approach to analyzing the properties of layers in integrated circuits, enhancing the understanding of their material composition and structural characteristics.
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