ON Semiconductor has been granted a patent for a jet impingement cooling assembly for semiconductor devices. The assembly includes a heat exchange base with inlet and outlet chambers, a jet plate with a jet pedestal and nozzle, and a chamber divider for efficient cooling. GlobalData’s report on ON Semiconductor gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on ON Semiconductor, was a key innovation area identified from patents. ON Semiconductor's grant share as of May 2024 was 59%. Grant share is based on the ratio of number of grants to total number of patents.
Jet impingement cooling assembly for semiconductor devices
A recently granted patent (Publication Number: US12002736B2) discloses a jet impingement cooling assembly designed for semiconductor devices. The assembly includes a heat exchange base with an inlet chamber and an outlet chamber, connected to a jet plate with a jet pedestal featuring a jet nozzle for cooling. A chamber divider within the base separates the chambers, ensuring efficient cooling by directing fluid flow onto the backside of the semiconductor device mounted on the module. The design allows for interchangeable jet plates with different jet nozzles, enhancing versatility in cooling applications.
Moreover, the patent also covers a method for manufacturing the jet impingement cooling assembly, involving the formation of the heat exchange base, chamber divider, and jet plate with a jet pedestal. By establishing fluid connections through the inlet and outlet chambers, the method ensures a streamlined cooling process for semiconductor devices. The incorporation of the chamber divider and jet pedestal in the assembly design highlights a systematic approach to optimizing cooling efficiency and thermal management in semiconductor applications.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
