The global technology industry experienced a 26% decline in the number of quantum computing-related patent applications in Q2 2024 compared with the previous quarter. The total number of quantum computing-related grants rose by 12% in Q2 2024, according to GlobalData’s Patent Analytics. GlobalData’s databook Technology: Patents Trends Q2 2024 offers comprehensive insights into patenting trends, major players’ strategies, and geographical focus in the sector over the last three years. Buy the databook here.

Notably, the number of quantum computing-related patent applications in the technology industry was 491 in Q2 2024, versus 665 in the prior quarter.

The top five companies accounted for 24% of patenting activity

Analysis of patenting activity by companies shows that Alphabet filed the most quantum computing patents within the technology industry in Q2 2024. The company filed 40 quantum computing-related patents in the quarter, compared with 37 in the previous quarter. It was followed by International Business Machines with 39 quantum computing patent filings, Toshiba (15 filings), and Microsoft (13 filings) in Q2 2024.

Patenting activity was driven by the US with a 43% share of total patent filings

The largest share of quantum computing related patent filings in the technology industry in Q2 2024 was in the US with 43%, followed by China (9%) and Japan (8%). The share represented by the US was 11% higher than the 32% share it accounted for in Q1 2024.

For further understanding of GlobalData's Technology: Patents Trends Q2 2024, buy the databook here.

This content was updated on 17 July 2024

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData’s Patent Analytics tracks patent filings and grants from official offices around the world. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.