US-based semiconductor company Rambus and ChipAgents have announced a strategic collaboration intended to accelerate chip design using agentic AI.

Under the agreement, Rambus will implement the ChipAgents agentic AI platform across its operations. It will apply the technology to chip and silicon intellectual property (IP) design and verification activities in an effort to increase development speed.

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The agentic AI platform is designed to convert specifications and code into production-ready register-transfer Level (RTL), verification assets, and automated root-cause analysis, with the goal of reducing design and verification cycle times.

ChipAgents integrates autonomous AI agents into semiconductor production workflows, supporting design engineers, verification engineers, and embedded systems teams at semiconductor firms.

Rambus president and CEO Luc Seraphin said: “AI is creating a virtuous cycle of innovation, driving demand for more advanced chips and increasingly complex systems while transforming the way those chips are designed.

“ChipAgents is a fellow industry pioneer and a leader in agentic AI for chip design, making the company a strong strategic investment for Rambus.

“By adopting the ChipAgents platform, we see opportunities to accelerate the pace of chip and IP development, enhance engineering productivity, and strengthen our long-term position in AI and data-centre infrastructure.”

The initiative also includes joint efforts to integrate Rambus’s semiconductor expertise with ChipAgents’s AI-native workflows.

Rambus stated that the collaboration aims to help customers improve the speed and quality of chip design within their chosen design environments.

In addition to the platform adoption, Rambus has invested in ChipAgents, selecting the company as a strategic partner in the development of AI-driven engineering capabilities for the semiconductor sector.

ChipAgents founder and CEO William Wang said: “Rambus has decades of semiconductor chip expertise and a broad portfolio of mission-critical silicon IP for state-of-the-art SoC designs. Together, we see an opportunity to move beyond automating individual tasks to a more holistic, AI-native approach to chip design.

“By combining Rambus’ design and IP expertise with our agentic AI platform, we aim to help engineering teams move more efficiently from design intent through silicon implementation while preserving their choice of tools and technologies.”

Rambus indicated it expects to introduce the ChipAgents platform to its engineering teams involved in both chip design and silicon IP projects.

The two companies plan to work together on developing workflows that combine Rambus’s silicon IP with ChipAgents’s tool-agnostic AI capabilities for customers seeking improved speed and integration.

Earlier this month, ChipAgents released Build-A-Chip-Bench, a benchmark developed in collaboration with Nvidia.

Build-A-Chip-Bench is intended to evaluate AI agents’ ability to complete end-to-end digital chip design tasks, from specification through physical implementation to verified GDS. It serves as a way to measure progress toward advanced AI capabilities in semiconductor design.