Rockley Photonics has been granted a patent for a method of manufacturing optoelectronic devices with mode converters. The process involves creating the device on one wafer and the converter on another, then bonding them together. GlobalData’s report on Rockley Photonics gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Rockley Photonics, was a key innovation area identified from patents. Rockley Photonics's grant share as of April 2024 was 46%. Grant share is based on the ratio of number of grants to total number of patents.
Method of manufacturing optoelectronic device with mode converter
A recently granted patent (Publication Number: US11966078B2) discloses a method for manufacturing an optoelectronic device with a mode converter. The method involves manufacturing the optoelectronic device on a first SOI wafer and the mode converter on a second SOI wafer, followed by bonding the mode converter to the first SOI wafer. The mode converter is formed as a tapered waveguide, decreasing in width along the guiding direction. The process includes preparing the second SOI wafer for a micro-transfer printing process by patterning a tether onto the mode converter and removing an insulator layer, leaving the mode converter suspended via the tether.
Furthermore, the method includes manufacturing input and output waveguides on the first SOI wafer, with the optoelectronic device being various devices like an electro-optic modulator, a laser, or a detector. Additional steps involve etching a device cavity, growing an optically active region, and forming an optically active waveguide. For devices like electro-optic modulators or detectors, doping regions of the waveguide and placing electrodes are part of the manufacturing process. The method also includes bonding a cover layer over the optoelectronic device before bonding the second wafer, and the possibility of manufacturing a further mode converter on another SOI wafer and bonding it to the first SOI wafer. Another variation of the method involves bonding a second SOI wafer to the first SOI wafer to form a combined wafer and etching a mode converter into the combined wafer, showcasing the versatility and complexity of the manufacturing process for optoelectronic devices with mode converters.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
