Seiko Epson had 75 patents in 3D printing during Q4 2023. The patents filed by Seiko Epson Corp in Q4 2023 relate to three-dimensional shaping stages, shaping devices, formed article production methods, manufacturing molding dies, and controllers for three-dimensional modeling apparatus. These inventions involve innovative techniques such as adjusting flatness, controlling discharge amount and pressure, recycling materials, and utilizing metal particles in resin. The shaping stages and devices aim to improve precision and efficiency in shaping objects, while the methods and controllers focus on optimizing the manufacturing process for various applications. GlobalData’s report on Seiko Epson gives a 360-degreee view of the company including its patenting strategy. Buy the report here.
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Seiko Epson grant share with 3D printing as a theme is 52% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Three-dimensional shaping stage and three-dimensional shaping apparatus (Patent ID: US20230415412A1)
The patent filed by Seiko Epson Corp. describes a three-dimensional shaping stage that includes a placement portion with an opening and a reference surface, a shaping stage with a shaping surface for stacking shaping layers, a heating unit below the shaping stage, a pressing unit to press the heating unit against the shaping stage, and a holding unit to secure the shaping stage to the reference surface. The design includes inclined surfaces on the shaping stage and holding unit, a biasing unit for adjustment, and a position adjustment mechanism for the shaping stage.
Additionally, the patent details a three-dimensional shaping apparatus incorporating the described shaping stage and a nozzle for discharging shaping material onto the shaping surface. The apparatus may also include a sensor to measure distances between the sensor and the shaping stage at various points while moving relative to the stage along the placement portion's side surface. The invention aims to provide an efficient and precise method for three-dimensional shaping using the described components and mechanisms.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
