Seiko Epson had 72 patents in 3D printing during Q2 2024. The patents filed by Seiko Epson Corp in Q2 2024 relate to manufacturing methods and devices for three-dimensional objects using extrusion technology. These inventions involve controlling the extruding unit based on design information, changing relative positions of nozzles and stages for multi-material deposition, generating support structures with contact and non-contact layers, utilizing a plate-shaped heating unit for lamination, and optimizing temperature control for modeling materials containing crystalline resin. GlobalData’s report on Seiko Epson gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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Seiko Epson had no grants in 3D printing as a theme in Q2 2024.

Recent Patents

Application: Manufacturing method of three-dimensional object and information processing apparatus (Patent ID: US20240208149A1)

The patent filed by Seiko Epson Corp. describes a manufacturing method for a three-dimensional object using an extruding unit to deposit layers of modeling material on a stage. The method involves acquiring designation information related to the center-of-gravity position or weight of the object, generating model data based on this information to control the extruding unit, and fabricating the object accordingly.

The claims associated with the patent detail additional aspects of the manufacturing method, such as including information for weight distribution, calculating and correcting center-of-gravity position or weight deviations, displaying calculated values, comparing distances between orientations, adjusting infill filling rate and other conditions based on designation information, and determining model data generation conditions. These claims highlight the comprehensive nature of the method in optimizing the fabrication process for three-dimensional objects based on specific design parameters provided.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.