SerComm. has filed a patent for a network communication device with a circuit board, network communication chip, antenna, and metal cover. The design includes a ground ring on the circuit board’s edge, ensuring electrical connection with the metal cover’s annular support rib for improved performance. GlobalData’s report on SerComm gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on SerComm, V2V communication antennas was a key innovation area identified from patents. SerComm's grant share as of January 2024 was 64%. Grant share is based on the ratio of number of grants to total number of patents.
Network communication device with improved grounding for antenna
The patent application (Publication Number: US20230413419A1) describes a network communication device comprising a circuit board with a ground layer and a ground ring on the first surface, an antenna, and a network communication chip. The device includes a first metal cover with an annular support rib that physically and electrically connects to the ground ring, providing electromagnetic shielding and heat dissipation for the network communication chip.
Additionally, the device features solder balls on the ground ring, a heat dissipation portion on the first metal cover, and a second metal cover for further shielding. The ground layer is connected to the ground ring through plated through holes, ensuring proper grounding. The device also includes an electromagnetic wave shielding cover and a connection port with a metal shell in contact with the annular support rib. The design elements aim to enhance the device's performance, thermal management, and electromagnetic compatibility, making it suitable for efficient network communication applications.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
