Sumco’s patented method evaluates semiconductor wafers by analyzing reflection and scattered light images to determine the distance between bright zones. Specifically designed for wafers with chamfered edges, the method assesses the boundary shape between the main surface and chamfered surface. The innovative technique enhances wafer quality control. GlobalData’s report on Sumco gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Sumco, 3D memory devices was a key innovation area identified from patents. Sumco's grant share as of April 2024 was 55%. Grant share is based on the ratio of number of grants to total number of patents.
Semiconductor wafer evaluation method for chamfered surface boundary shape
The granted patent (Publication Number: US11955390B2) discloses a method for evaluating semiconductor wafers, specifically focusing on the shape of the boundary part between the main surface and the chamfered surface in the wafer outer peripheral edge section. The method involves acquiring reflection and scattered images by irradiating the wafer with light and calculating the distance between bright zones in these images. By evaluating this distance, the shape of the boundary part can be determined. The method also includes specific angles and directions for obtaining the scattered image to ensure accurate evaluation.
Furthermore, the patent also describes methods for manufacturing semiconductor wafers based on the evaluation process. It includes evaluating individual wafers or entire wafer lots using the previously mentioned method and determining non-defective products for shipment. Additionally, there is a provision for test manufacturing conditions, where an evaluation semiconductor wafer is manufactured under specific conditions, evaluated, and then the manufacturing conditions are adjusted based on the evaluation results. This adjustment can involve modifying polishing or chamfering conditions of the wafer surface to improve the manufacturing process.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
