Taiwan Semiconductor Manufacturing had 16 patents in connectivity during Q2 2024. The patents filed by Taiwan Semiconductor Manufacturing Co Ltd in Q2 2024 include devices with grating structures on a dielectric layer, a thermally tunable waveguide with a heater, a photonics structure with ring and rail optical waveguides, a method for bonding electronic and photonic integrated circuits, and a method for forming waveguides with low-dimensional materials and dielectric layers. GlobalData’s report on Taiwan Semiconductor Manufacturing gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Taiwan Semiconductor Manufacturing had no grants in connectivity as a theme in Q2 2024.
Recent Patents
Application: Grating coupler and method of manufacturing the same (Patent ID: US20240210619A1)
The patent filed by Taiwan Semiconductor Manufacturing Co Ltd describes a device with a dielectric layer, grating structures, and dielectric material. The grating structures are arranged on the dielectric layer, separated, and have varying widths between the top and bottom portions. The device aims to improve optical coupling efficiency and performance in silicon photonics applications.
The claims detail the specific configurations and materials used in the device, such as the heights, widths, and materials of the grating structures, dielectric layer, and dielectric material. The method for fabricating the grating structure involves depositing different dielectric materials, etching to form the grating structures, and depositing a conformal layer. The grating coupler for silicon photonics includes a base, grating structures with specific dimensions, dielectric material in trenches, and a dielectric layer. Overall, the patent focuses on optimizing the design and fabrication process of grating structures for enhanced optical performance in silicon photonics applications.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
