Taiwan Semiconductor Manufacturing had 11 patents in robotics during Q2 2024. The patents filed by Taiwan Semiconductor Manufacturing Co Ltd in Q2 2024 include methods and systems for cleaning lithography systems, manufacturing semiconductor electronic devices, enclosing reticles, chemical mechanical planarization systems, and inspecting wafer carriers using cameras and processors. These innovations aim to improve the efficiency and accuracy of semiconductor manufacturing processes. GlobalData’s report on Taiwan Semiconductor Manufacturing gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Taiwan Semiconductor Manufacturing had no grants in robotics as a theme in Q2 2024.
Recent Patents
Application: Method of cleaning wafer table of photolithography system and method of manufacturing integrated circuit (Patent ID: US20240210842A1)
The patent filed by Taiwan Semiconductor Manufacturing Co Ltd describes a method for cleaning a lithography system during idle mode by directing a stream of air through an opening in the wafer table chamber to extract particles from wafer chucks. The extracted particles are then drawn out of the chamber through a second opening. The method involves filtering the extracted gas, determining the amount of particles or organic material present, and recycling the filtered gas based on threshold values.
The method includes various claims such as blowing gas through openings in the wafer table, filtering the gas, recycling it based on particle or organic material content, and using a series of stages for filtration. The patent also covers circulating gas through the wafer table, filtering it, determining particle and organic material content, and recycling the gas accordingly. Additionally, the method involves sweeping the interior of the wafer table with a fan-shaped stream of gas, using a plurality of nozzles for gas circulation, and changing the direction of gas circulation by moving the nozzles. The patent also includes a claim for manufacturing an integrated circuit by performing the cleaning method and exposing a layer of photoresist on a wafer to extreme ultraviolet radiation.
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