Tokyo Seimitsu has filed a patent for a processing device that performs rough grinding, medium grinding, and fine grinding on a workpiece. The device includes an index table with multiple chucks for holding the workpiece and transporting it through the different grinding stages. The device also features two columns, with one column housing either the rough grinding or fine grinding means, and the other column housing the medium grinding means along with the remaining grinding means arranged parallel to it. This design aims to achieve precise and satisfactory grinding results while minimizing the influence of rough grinding. GlobalData’s report on Tokyo Seimitsu gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Tokyo Seimitsu, Welding robots was a key innovation area identified from patents. Tokyo Seimitsu's grant share as of September 2023 was 34%. Grant share is based on the ratio of number of grants to total number of patents.
A processing device for rough, medium, and fine grinding
A recently filed patent (Publication Number: US20230302603A1) describes a processing device that performs rough grinding, medium grinding, and fine grinding on a workpiece in a specific order. The device includes an index table with multiple chucks to hold the workpiece and transport it through the different grinding stages.
The processing device consists of two columns that extend over the index table. One column houses either the rough grinding means or the fine grinding means, while the other column contains the medium grinding means. The rough grinding means can be located on either the first or second column, depending on the configuration.
In one configuration, the rough grinding means is on the first column, the fine grinding means is on the second column, and the workpiece undergoes fine grinding while the index table is displaced equally in the fine grinding stage. This ensures consistent and precise fine grinding results.
In another configuration, the fine grinding means is on the first column, the rough grinding means is on the second column, and the workpiece undergoes fine grinding while reducing propagated vibration from the medium grinding means to the fine grinding means. This helps to minimize any potential disturbances during the fine grinding process.
The index table is designed to be rotatable in both clockwise and counterclockwise directions when viewed in a plane. This allows for flexibility in the positioning and movement of the workpiece during the grinding stages.
Overall, this patent describes a processing device that offers a systematic approach to grinding a workpiece, with specific arrangements of grinding means and a rotatable index table. These features aim to improve the efficiency and precision of the grinding process.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
