Tokyo Seimitsu has been granted a patent for a workpiece processing device that efficiently cuts cylindrical-shaped surfaces. The device includes a workpiece supporting unit, cutting unit with a blade, detecting unit for calculating surface position, and control unit for precise cutting. GlobalData’s report on Tokyo Seimitsu gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Tokyo Seimitsu, Welding robots was a key innovation area identified from patents. Tokyo Seimitsu's grant share as of May 2024 was 46%. Grant share is based on the ratio of number of grants to total number of patents.
Workpiece processing device for cutting cylindrical-shaped surfaces accurately
A recently granted patent (Publication Number: US11964361B2) discloses a workpiece processing device designed to efficiently process cylindrical-shaped workpieces. The device includes a workpiece supporting unit that can rotate around a first axis, accommodating the workpiece in various orientations. A cutting unit with a blade is used to cut the workpiece's surface, while a detecting unit calculates the position of the surface's vertex in a direction perpendicular to the cutting plane. A control unit then ensures the cutting position aligns with the vertex, moving the workpiece supporting unit and cutting unit accordingly to create a groove at the cutting position.
Furthermore, the workpiece processing device features a control device with a central processing unit connected to the workpiece supporting unit and cutting unit. This unit performs the functions of detecting the surface's vertex and controlling the cutting process. The device also includes a rotary table as part of the workpiece supporting unit, with the vertex position being the farthest point from the axis of rotation. The central processing unit can calculate multiple vertices' positions during rotation, determine the workpiece's center locus, and calculate the cutting position based on the center's position and the workpiece's radius. Additionally, the device may include a camera for imaging the workpiece surface and a sensor unit to measure the cutting position's height, allowing for adjustments to the blade's incision depth based on the measurement results.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
