Winbond Electronics has been granted a patent for a semiconductor light-emitting element with a unique design. The element includes specific layers and electrodes, with a focus on efficient connectivity and grain size optimization for improved performance. GlobalData’s report on Winbond Electronics gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Winbond Electronics, Magnetic RAMs was a key innovation area identified from patents. Winbond Electronics's grant share as of May 2024 was 76%. Grant share is based on the ratio of number of grants to total number of patents.
Semiconductor light-emitting element with improved electrical connection
A recently granted patent (Publication Number: US12002914B2) discloses a semiconductor light-emitting element with unique features aimed at improving performance and connectivity. The element includes a semiconductor stack with an n-type layer, a light-emitting layer, and a p-type layer, featuring an n exposure portion and wiring electrode layers. Notably, the element incorporates first n connecting members made of specific materials like Au, Ag, Al, or Cu, with a larger grain size for enhanced conductivity. Additionally, the patent details the inclusion of second n connecting members and p connecting members for external connections, further enhancing the element's functionality and versatility.
Moreover, the patent extends to a semiconductor light-emitting device comprising the aforementioned element and a mounting board with wiring electrodes. The device showcases innovative bonding configurations for the connecting members, ensuring secure connections for efficient operation. The design also emphasizes the grain size variation of the connecting members based on their location within the element, highlighting a strategic approach to optimize performance. Overall, the patent presents a comprehensive solution for semiconductor light-emitting elements and devices, incorporating novel features to enhance connectivity and functionality in various applications.
To know more about GlobalData’s detailed insights on Winbond Electronics, buy the report here.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
