Wingtech Technology has been granted a patent for a bipolar transistor semiconductor device with a substrate layer, collector epitaxial layer, base region, and emitter region with polysilicon material. The device also includes a layer of Titanium and/or Aluminium with AlSi and/or AlSiCu supported by the layers. GlobalData’s report on Wingtech Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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According to GlobalData’s company profile on Wingtech Technology, was a key innovation area identified from patents. Wingtech Technology's grant share as of May 2024 was 39%. Grant share is based on the ratio of number of grants to total number of patents.

Bipolar transistor semiconductor device with polysilicon emitter region

Source: United States Patent and Trademark Office (USPTO). Credit: Wingtech Technology Co Ltd

A recently granted patent (Publication Number: US11996474B2) discloses a novel bipolar transistor semiconductor device. The device comprises a substrate layer, a collector epitaxial layer, a base region, and an emitter region. The emitter region is made of polysilicon material and is supported by the base region. Additionally, a layer of Titanium (Ti) and/or Aluminium (Al) is present, supported by the collector epitaxial layer, base region, and emitter region, with the layer further comprising AlSi and/or AlSiCu. The device's construction and materials used offer unique properties and performance enhancements.

Furthermore, the patent includes a method for fabricating the bipolar transistor semiconductor device. The method involves forming the collector epitaxial layer directly on the substrate layer, creating the base region within the collector epitaxial layer, and developing the emitter region with a polysilicon material on top of the base region. A layer of Titanium (Ti) and/or Aluminium (Al) is then added, supported by the collector epitaxial layer, base region, and emitter region, with additional components like AlSi and/or AlSiCu. The fabrication process outlined in the patent ensures precise construction and functionality of the semiconductor device, showcasing advancements in manufacturing techniques for such components.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.