AAC Technologies has filed a patent for a micro speaker that aims to improve sound quality. The speaker includes a frame with a containment space, a magnetic circuit system, and a vibration system. The vibration system consists of a diaphragm, a circuit board, a skeleton, and a voice coil. The patent also introduces a welding plate structure and a balance component to ensure weight balance and stability during operation. GlobalData’s report on AAC Technologies gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on AAC Technologies, V2V communication antennas was a key innovation area identified from patents. AAC Technologies's grant share as of June 2023 was 1%. Grant share is based on the ratio of number of grants to total number of patents.
The patent filed is for a micro speaker with improved sound quality
A recently filed patent (Publication Number: US20230209272A1) describes a micro speaker with several innovative features. The speaker includes a frame with a containment space, a magnetic circuit system, and a vibration system. The vibration system consists of a first diaphragm, a circuit board, a skeleton, and a voice coil. The voice coil is responsible for driving the skeleton to vibrate and produce sound.
One unique aspect of this micro speaker is the inclusion of a welding plate structure and a balance component. These components are located on opposite sides of the voice coil and serve to balance the weight of the welding plate structure and the lead wire. The voice coil is electrically connected to the welding plate structure via a lead wire.
The skeleton of the micro speaker includes a bottom plate connected to the first diaphragm and two side walls extending from the bottom plate to the magnetic circuit system. The circuit board is fixedly connected to one end of the side walls, and the voice coil is fixed on the bottom plate near the magnetic circuit system. The welding plate structure is located between a side wall and the voice coil, while the balance component is fixed to the other side wall.
The circuit board of the micro speaker includes two sub-circuit boards located on opposite sides of the voice coil. One end of the sub-circuit boards is connected to the basic frame, while the other end is connected to the corresponding end of the side wall away from the bottom plate.
The balance component can be arranged on either side of the side wall, close to or away from the voice coil. It can also be arranged near the sub-circuit board or cover the side surface of the side wall.
The welding plate structure consists of a guide plate fixed to the corresponding sub-circuit board, a welding plate fixed on the bottom plate, and a welding ball fixed on the welding plate and electrically connected to the lead wire.
The skeleton of the micro speaker is arranged symmetrically, and the balance component and the welding plate structure are also arranged symmetrically with the symmetrical axis of the skeleton. The weight of the balance component is equal to the sum of the weights of the welding plate structure and the lead wire.
The balance component can be made of sticky material or metal welding material.
The magnetic circuit system of the micro speaker includes a first magnet with a containment groove, a second magnet fixed to the first magnet and located in the containment groove, and a magnetic gap between the second magnet and the first magnet. The magnetic gap partially receives the voice coil.
Overall, this patent describes a micro speaker with a unique design that includes a welding plate structure, a balance component, and a symmetrical arrangement of components. These features aim to improve the performance and stability of the micro speaker.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
