Advantest has filed a patent for a testing apparatus that includes a tester with multiple racks, each containing slots. Each slot has an interface board with test circuitry and sockets for receiving devices under test (DUTs). The apparatus also includes a carrier with an array of DUTs that can be inserted into the slots, aligning with the sockets on the interface board. The apparatus further includes a pick-and-place mechanism for loading the DUTs into the carrier and an elevator for transporting the carrier to the slots. The patent claim describes the apparatus as having vertically arranged test slots with circuitry and sockets, and a carrier with membrane pockets for holding the DUTs. The carrier can be inserted into a test slot, allowing the DUTs to make electrical and physical contact with the sockets for testing. GlobalData’s report on Advantest gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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According to GlobalData’s company profile on Advantest, NFC-enabled implants was a key innovation area identified from patents. Advantest's grant share as of September 2023 was 36%. Grant share is based on the ratio of number of grants to total number of patents.

Testing apparatus with vertically arranged test slots and carrier

Source: United States Patent and Trademark Office (USPTO). Credit: Advantest Corp

A recently filed patent (Publication Number: US20230314512A1) describes a testing apparatus for devices under test (DUTs). The apparatus consists of a plurality of vertically arranged test slots, each equipped with circuitry to test the DUT and at least one socket. The apparatus also includes a carrier with at least one membrane pocket designed to hold the DUT. The carrier can be inserted into a test slot, allowing the DUT to be pushed through the membrane pocket to make electrical and physical contact with the socket.

Each test slot in the apparatus may further include at least one actuator aligned at a vertical spacing relative to the socket. Additionally, there may be a socket cover positioned below the actuator. The actuator is operable to press the socket cover onto the top of the DUT, pushing it through the membrane pocket to establish contact with the socket. This arrangement, along with the socket and carrier, forms an RF shield around the DUT.

Furthermore, the test slots may feature package-on-package (POP) structures positioned below the actuator. The actuator can press the POP structure to electrically connect with the top of the DUT, facilitating its insertion through the membrane pocket to establish contact with the socket.

The patent also describes a method for using the testing apparatus. The method involves inserting a carrier with a membrane pocket into a test slot, creating a testing arrangement where the DUT is pushed through the membrane pocket to make contact with the socket. This can be achieved by actuating a socket cover positioned above the socket to press the top of the DUT. Alternatively, a POP structure can be actuated to press and electrically connect with the top of the DUT, facilitating its insertion through the membrane pocket.

The method may also include testing the DUT and the POP structure together. Once the testing is completed, the carrier can be removed from the test slot and re-inserted with an untested DUT.

Overall, this patent presents a testing apparatus and method that allows for efficient and reliable testing of devices under test. The apparatus features vertically arranged test slots with various components, such as actuators, socket covers, and POP structures, to facilitate the testing process. The method involves inserting the DUT into a carrier with a membrane pocket and creating a testing arrangement by pushing the DUT through the membrane pocket to establish contact with the socket.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.