Aehr Test Systems patented a method for testing integrated circuits using air pressure to move contactors against device contacts. The method involves compensating pieces for planarity, cartridge mounting, connector interface connection, signal transmission, and contactor board assembly replacement. GlobalData’s report on Aehr Test Systems gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Aehr Test Systems, 3D memory devices was a key innovation area identified from patents. Aehr Test Systems's grant share as of May 2024 was 45%. Grant share is based on the ratio of number of grants to total number of patents.
Method of testing integrated circuits using contactor board assembly
A recently granted patent (Publication Number: US11977098B2) discloses a method and apparatus for testing an integrated circuit of a device. The method involves using a compensating piece with a profiled surface to improve planarity, removably mounting a cartridge frame to an apparatus frame, connecting interfaces, holding the device against a holder, moving the contactor board assembly to bring terminals into contact with the device's contacts, providing signals to the integrated circuit, and replacing unique contactor subassemblies. The apparatus includes an apparatus frame, a cartridge with a contactor support structure, compensating piece, and terminals, a power source, signal source, and electrical components mounted on the contactor support structure.
The patent also covers a cartridge with formations for mounting to an apparatus frame, a subassembly with a contactor support structure, compensating piece, terminals, contactor interface, and conductors. The cartridge allows for the replacement of unique contactor subassemblies and features a compensating piece with a profiled surface to improve planarity. The method and apparatus involve actuating components to move the contactor support structure, allowing air through a fluid line to modify volume, and reducing pressure between subassemblies. The design aims to enhance the testing process for integrated circuits by ensuring proper contact and signal transmission between components.
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