Amkor Technology. has filed a patent for a semiconductor device with a substrate, electronic component, lid structure, and vertical interconnect. The claim has been canceled. GlobalData’s report on Amkor Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Amkor Technology, Under-screen biometric identification was a key innovation area identified from patents. Amkor Technology's grant share as of January 2024 was 58%. Grant share is based on the ratio of number of grants to total number of patents.
Semiconductor device with vertical interconnect in lid structure
The patent application (Publication Number: US20240038606A1) describes a semiconductor device and a method for manufacturing the same. The semiconductor device includes a base component, a substrate with a conductive structure, an electronic component, a lid structure, and a vertical interconnect. The lid structure may have a different material than the substrate and can include a cavity for housing the electronic component. Additionally, the device may have seals between the lid structure and the substrate to ensure proper functioning.
Furthermore, the method for manufacturing the semiconductor device involves providing a substrate on a base component with a vertical interconnect, placing an electronic device on the substrate, adding a seal, and placing a lid structure over the substrate and electronic device. The base component is typically made of semiconductor material, and the lid structure may have a different material than the substrate. The seal is attached to the lid structure and placed on the substrate when the lid structure is added. These innovations aim to enhance the performance and reliability of semiconductor devices in various applications, including optical devices and Light-Detection-And-Ranging (LiDAR) devices.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
