Fujitsu has been granted a patent for a semiconductor device with a metal chip mounting member and a semiconductor chip bonded through a metal sintered material. The material has specific porosity ratios in different portions, ensuring efficient performance and reliability in electronic applications. GlobalData’s report on Fujitsu gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Fujitsu, M2M communication interfaces was a key innovation area identified from patents. Fujitsu's grant share as of May 2024 was 35%. Grant share is based on the ratio of number of grants to total number of patents.
Semiconductor device with metal sintered material for bonding chips
A recently granted patent (Publication Number: US12009333B2) discloses a semiconductor device and a method for making the same. The semiconductor device comprises a chip mounting member and a semiconductor chip bonded to the chip mounting member through a metal sintered material. The unique aspect of this invention lies in the structure of the metal sintered material, which includes a first portion exactly overlapping the semiconductor chip and a second portion surrounding the first portion without any gap. The porosity ratio and thickness of these portions are carefully controlled to optimize the performance of the semiconductor device.
Furthermore, the method for making this semiconductor device involves printing a paste of a metal sintered material at and around a chip mounting area, applying pressure to the paste, and bonding the semiconductor chip to the chip mounting member through the metal sintered material in a heated atmosphere. The method ensures that the porosity ratio and thickness of the metal sintered material are maintained within specific ranges to achieve the desired outcome. This innovative approach to semiconductor device manufacturing could potentially lead to more efficient and reliable devices in the future, with applications in various industries where semiconductor technology is utilized.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
