Zhen Ding Technology has been granted a patent for a covering film that includes a thermal conductive layer sandwiched between a covering layer and an adhesive layer. The thermal conductivities of these layers are specified within defined ranges, enhancing thermal management in circuit board applications. GlobalData’s report on Zhen Ding Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Zhen Ding Technology, Under-screen biometric identification was a key innovation area identified from patents. Zhen Ding Technology's grant share as of June 2024 was 49%. Grant share is based on the ratio of number of grants to total number of patents.
Thermal conductive covering film for circuit boards
The granted patent US12048084B2 describes a novel covering film designed for use in circuit boards, comprising a first covering layer, a first adhesive layer, and a thermal conductive layer positioned between the two. The thermal conductive layer is formulated with a base material and first thermal conductive powders, achieving a thermal conductivity (K1) ranging from 3 W/m.K to 65 W/m.K. In contrast, the first covering layer (K2) has a thermal conductivity between 0.02 W/m.K and 3.0 W/m.K, while the first adhesive layer (K3) ranges from 0.02 W/m.K to 1.0 W/m.K. The base material for the thermal conductive layer can include polyimide, epoxy resin, and other polymers, with the thermal conductive powders potentially comprising graphene, carbon fibers, and silver powders.
Additionally, the patent outlines a manufacturing method for circuit boards that involves forming the covering film on wiring layers of an inner substrate. The method includes the option to create a second covering film on the opposite wiring layer and the possibility of bonding a steel plate to the first covering layer using a conductive adhesive. The design allows for electrical connections between the wiring layers and the steel plate through defined holes in the covering film. The thickness specifications for the layers are also detailed, with the first covering layer ranging from 7.5 µm to 25 µm, the adhesive layer from 5 µm to 50 µm, and the thermal conductive layer from 3 µm to 15 µm. This innovative approach aims to enhance thermal management in circuit board applications.
To know more about GlobalData’s detailed insights on Zhen Ding Technology, buy the report here.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
