Lumentum has been granted a patent for an optical device designed for flip-chip configuration. The device features a unique arrangement of flip-chip bumps and a gap separating primary and secondary regions, with sides oriented at non-zero angles to the crystal cleavage plane. GlobalData’s report on Lumentum gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Lumentum, was a key innovation area identified from patents. Lumentum's grant share as of February 2024 was 79%. Grant share is based on the ratio of number of grants to total number of patents.
Optical device with non-aligned flip-chip bumps and gap
A recently granted patent (Publication Number: US11923653B2) discloses an optical device designed for mounting in a flip-chip configuration. The device includes a primary region, a secondary region, and a gap separating the two regions. Notably, the sides of the gap are oriented at different non-zero angles to a crystal cleavage plane associated with the substrate of the optical device. This unique configuration allows for the creation of mechanical stress along the crystal cleavage plane, satisfying a specific mechanical stress breakage threshold. Additionally, the device may feature flip-chip bumps arranged in a pattern on either region, with the pattern not necessarily aligned with the crystal cleavage plane.
Furthermore, the patent also covers a wafer comprising multiple chips with similar gap configurations and crystal cleavage plane orientations. The chips may include chip bumps arranged in various patterns, influenced by the rotation of a mask during manufacturing. These patterns can be uniform or non-uniform, with multiple rows of chip bumps that are laterally offset from each other. The disclosed wafer design, similar to the optical device, aims to optimize mechanical stress distribution along the crystal cleavage plane, particularly in the context of vertical-cavity surface-emitting laser (VCSEL) chips. The patent highlights the importance of the unique orientation of gap sides in achieving the desired mechanical stress levels for enhanced device performance and reliability.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
