Marvell Technology has been granted a patent for an in-packaged multi-channel light engine. The light engine includes multiple sub-assemblies with laser chips, driver chips, and trans-impedance amplifier chips mounted on a silicon photonics interposer. It also features a frame fixture, an interposer plate, and a heatsink with fin structures. The design aims to minimize the length of electrical connections and integrate optical and integrated circuit devices efficiently. GlobalData’s report on Marvell Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Marvell Technology, Network virtualization was a key innovation area identified from patents. Marvell Technology's grant share as of September 2023 was 79%. Grant share is based on the ratio of number of grants to total number of patents.
In-packaged multi-channel light engine with integrated optical-electrical sub-modules
A recently granted patent (Publication Number: US11777631B2) describes a light engine and an integrated circuit assembly. The light engine includes a first substrate with through substrate vias (TSVs) and a first integrated circuit mounted on one surface. A separate silicon photonics substrate is connected to the first substrate through TSVs and includes optical devices and integrated circuit devices mounted on its surface. The TSVs integrate the optical devices and integrated circuit devices on the silicon photonics substrate, minimizing the length of electrical connections between the first integrated circuit and the devices on the silicon photonics substrate.
The light engine also includes digital signal processors (DSPs) mounted on the first substrate, which are connected to the optical devices and integrated circuit devices through the TSVs. Additionally, a microcontroller is mounted on the first substrate and controls the optical devices and integrated circuit devices through the TSVs.
The integrated circuit assembly comprises multiple light engines, each with a first substrate, a silicon photonics substrate, and TSVs connecting them. An interposer with sets of TSVs is mounted with the light engines, and a second substrate with electrical contacts is connected to the interposer. The interposer has openings for mounting the first integrated circuit of each light engine, and the TSVs are arranged around these openings. The second substrate's electrical contacts align with the TSVs of the interposer.
The integrated circuit assembly may also include a heat sink in thermal contact with the light engines to dissipate heat. A backplate with windows can improve thermal conductivity, and additional circuits can be mounted on the opposite surface of the second substrate. A frame with windows surrounds the light engines, and the backplate includes alignment pins to align the TSVs, interposer, and electrical contacts. Compression pins lock the assembly together.
Overall, this patent describes a light engine and integrated circuit assembly that integrate optical devices and integrated circuit devices on a silicon photonics substrate, minimizing the length of electrical connections. The assembly allows for efficient control and communication between the various components, with provisions for heat dissipation and additional circuit mounting.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
