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The global technology industry experienced a 15% decline in the number of cybersecurity-related patent applications in Q3 2023 compared with the previous quarter. The total number of cybersecurity-related grants dropped by 20% in Q3 2023, according to GlobalData’s Patent Analytics. GlobalData’s databook Technology: Patents Trends Q3 2023 offers comprehensive insights into patenting trends, major players’ strategies, and geographical focus in the sector over the last three years. Buy the databook here.

Notably, the number of cybersecurity-related patent applications in the technology industry was 17,169 in Q3 2023, versus 20,105 in the prior quarter.

The top five companies accounted for 9% of patenting activity

Analysis of patenting activity by companies shows that Huawei Investment filed the most cybersecurity patents within the technology industry in Q3 2023. The company filed 451 cybersecurity-related patents in the quarter, compared with 558 in the previous quarter. It was followed by Samsung Group with 316 cybersecurity patent filings, International Business Machines (285 filings), and Qualcomm (277 filings) in Q3 2023.

Patenting activity was driven by China with a 37% share of total patent filings

The largest share of cybersecurity related patent filings in the technology industry in Q3 2023 was in China with 37%, followed by the US (32%) and South Korea (4%). The share represented by China was 1% higher than the 36% share it accounted for in Q2 2023.

For further understanding of GlobalData's Technology: Patents Trends Q3 2023, buy the databook here.

This content was updated on 16 October 2023

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData’s Patent Analytics tracks patent filings and grants from official offices around the world. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.