Rigetti and has been granted a patent for an integrated quantum circuit. The circuit includes two substrates, with the first substrate having a recess to enclose a quantum circuit element. The first substrate has a superconducting layer, while the second substrate has a quantum circuit element and a superconducting layer. The two substrates are assembled together to enclose the quantum circuit device and establish electrical coupling between the superconducting layers. GlobalData’s report on Rigetti and gives a 360-degree view of the company including its patenting strategy. Buy the report here.
Smarter leaders trust GlobalData
Access deeper industry intelligence
Experience unmatched clarity with a single platform that combines unique data, AI, and human expertise.
According to GlobalData’s company profile on Rigetti and, Superconducting quantum circuits was a key innovation area identified from patents. Rigetti and's grant share as of September 2023 was 55%. Grant share is based on the ratio of number of grants to total number of patents.
Integrated quantum circuit with enclosed quantum circuit device
A recently granted patent (Publication Number: US11770982B1) describes a method for fabricating an integrated quantum circuit. The method involves several steps to create a functional quantum circuit device.
The first step is to form a recess in a first substrate, which will enclose the quantum circuit device. A first electrically-conductive layer, made of a superconducting material, is then deposited over the first substrate and the recess surface. This layer will provide electrical conductivity for the circuit.
Next, a second electrically-conductive layer, also made of a superconducting material, is deposited on the second surface of a second substrate. The quantum circuit device is formed on this second substrate and is in contact with the second surface.
The final step is to assemble the first substrate and the second substrate. This process encloses the quantum circuit device within the recess of the first substrate and electrically couples the first electrically-conductive layer with the second electrically-conductive layer.
The patent also describes various variations of the method. For example, the first electrically-conductive layer can be patterned, meaning it is deposited in a specific design or shape. Additionally, multiple layers can be deposited to form a multi-layer stack, with at least one layer made of the superconducting material.
The deposition of the first electrically-conductive layer can involve multiple steps, such as depositing a layer of niobium followed by a layer of an alloy of molybdenum and rhenium. Similarly, the second electrically-conductive layer can be patterned or formed as a multi-layer stack.
To electrically couple the first and second electrically-conductive layers, a third superconducting material, such as indium, can be used. This can be achieved through the deposition of a patterned layer or by coupling a bump of the third superconducting material to the first electrically-conductive layer.
Overall, this patent provides a detailed method for fabricating an integrated quantum circuit, which could have significant implications for the development of quantum computing and other quantum technologies.
To know more about GlobalData’s detailed insights on Rigetti and, buy the report here.
Data Insights
From
The gold standard of business intelligence.
Blending expert knowledge with cutting-edge technology, GlobalData’s unrivalled proprietary data will enable you to decode what’s happening in your market. You can make better informed decisions and gain a future-proof advantage over your competitors.
GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
