Seiko Epson had 81 patents in robotics during Q1 2024. Seiko Epson Corp filed patents for a gripping device with variable speed based on contact force, a robot teaching method for setting printing posture, a pressure sensor for measuring object hardness, a 3D printing apparatus with a rotating head unit, and a vibration generation device with attenuation unit for reducing vibration. GlobalData’s report on Seiko Epson gives a 360-degree view of the company including its patenting strategy. Buy the report here.

Seiko Epson grant share with robotics as a theme is 61% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.

Recent Patents

Application: Gripping device, robot, and control method for gripping device (Patent ID: US20240100718A1)

The patent filed by Seiko Epson Corp describes a gripping device that includes a gripper, pressure sensor, driver, and controller. The controller operates the driver in different modes based on the detection signal from the pressure sensor, adjusting the speed of decreasing the distance between the gripper and the object. The device is designed to grip objects with varying contact forces efficiently and safely.

Additionally, the patent includes claims related to the calculation of contact force magnitude, waveform control of the drive signal, design of the pressure sensor with a dome-shaped elastic member, integration of the gripping device into a robot with a robot arm and imager, and a control method for the gripping device. These claims highlight the versatility and adaptability of the gripping device for use in various applications, including robotics and automation, where precise and controlled gripping of objects is essential.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.