According to GlobalData’s company profile on Sino-American Silicon Products, Artificial photosynthesis was a key innovation area identified from patents. Sino-American Silicon Products's grant share as of September 2023 was 46%. Grant share is based on the ratio of number of grants to total number of patents.

Wire saw slicing method with non-linear pitch and thickness values

A recently filed patent (Publication Number: US20230311363A1) describes a method for improving the thickness uniformity of slices obtained by simultaneously slicing a multiplicity of slices from a workpiece using a wire saw. The method involves moving the wire of the wire saw relative to the workpiece by rotating wire guide rollers. The wire guide rollers have a casing with wire-guiding grooves, and a wire web composed of wire sections is stretched between the wire guide rollers. The workpiece is fed to the wire sections of the wire web in the presence of abrasives, allowing the wire sections to saw completely through the workpiece.

To improve thickness uniformity, the patent proposes selecting a non-linear pitch function based on target thickness characteristic value function, a pitch function, and a thickness characteristic value function. The non-linear pitch function assigns a pitch of adjacent grooves in the casing of the wire guide rollers at a specific position during the slicing operation. The target thickness characteristic value function assigns a target thickness characteristic value to the slices obtained during the slicing operation at the same position. The pitch function assigns a pitch to adjacent grooves in the casing of the wire guide rollers at the same position during preceding slicing operations. By selecting the appropriate pitch function, target thickness characteristic value function, and thickness characteristic value function, the method aims to achieve a more uniform thickness of the sliced slices.

The patent also describes a wire saw that incorporates the proposed method. The wire saw includes wire guide rollers with casings provided with grooves that guide the wire of the wire web. The pitch between adjacent grooves at a specific position is defined by a non-linear pitch function. This non-linear pitch function is selected to satisfy an equation that takes into account the target thickness characteristic value function, the thickness characteristic value function, and the pitch function. By designing the wire saw with the appropriate pitch function, target thickness characteristic value function, and thickness characteristic value function, the wire saw aims to achieve improved thickness uniformity in the sliced slices.

Overall, this patent presents a method and a wire saw design that aim to improve the thickness uniformity of slices obtained through wire sawing. By selecting the appropriate pitch function and considering target thickness characteristic values and thickness characteristic values, the method and wire saw design aim to achieve more consistent thickness in the sliced slices.

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