Taiwan Semiconductor Manufacturing had 11 patents in robotics during Q1 2024. The patents filed by Taiwan Semiconductor Manufacturing Co Ltd in Q1 2024 include a reticle inspection and purging method, a behavior recognition device for semiconductor manufacturing apparatus, a space filling device for wet bench chemical replacement procedures, a workpiece chuck with a gas permeable buffer layer, and a cleaning device for tool cleaning with reduced contamination. GlobalData’s report on Taiwan Semiconductor Manufacturing gives a 360-degree view of the company including its patenting strategy. Buy the report here.

Taiwan Semiconductor Manufacturing grant share with robotics as a theme is 45% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.

Recent Patents

Application: Reticle inspection and purging method and tool (Patent ID: US20240103359A1)

The patent filed by Taiwan Semiconductor Manufacturing Co Ltd describes a method for reticle inspection and purging in lithography tools. The method involves moving a reticle from a load port to an inspection tool outside the lithography tool, inspecting the reticle, determining its suitability for exposure, and purging it if necessary. The process also includes calibrating the position and orientation of the reticle before inspection, as well as re-inspecting the reticle after purging.

Additionally, the patent outlines a tool that includes a reticle inspection tool, a reticle purging tool, a robot arm for transferring the reticle between different tools, an image analyzer to detect particle conditions on the reticle, and a purging controller to activate the purging tool based on the image analysis. The tool design features specific components such as inner and outer forks on the robot arm, an anti-collision bar, and a crash sensor for efficient and safe reticle handling during the inspection and purging process.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.