Tokyo Electron had three patents in big data during Q4 2023. The patent filed by Tokyo Electron Ltd in Q4 2023 describes a method for forming a semiconductor device by using a first metal layer on top of an amorphous mask layer, a second metal layer on vertical sidewalls of openings in the mask layer, and etching a pattern in the substrate with these layers as an etch mask. GlobalData’s report on Tokyo Electron gives a 360-degreee view of the company including its patenting strategy. Buy the report here.
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Tokyo Electron grant share with big data as a theme is 66% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Metal hardmasks (Patent ID: US20230397416A1)
The patent filed by Tokyo Electron Ltd. describes a method for forming a semiconductor device involving the use of a first metal layer on an amorphous mask layer, a second metal layer covering vertical sidewalls of openings in the mask layer, and etching a pattern in the substrate using both metal layers as an etch mask. The method aims to improve the precision and efficiency of semiconductor device fabrication by utilizing specific metal layers and an amorphous mask layer.
The claims in the patent detail various aspects of the method, including the composition of the metal layers, the materials used for the amorphous mask layer, and the specific applications of the method in forming different components of semiconductor devices such as 3D NAND memory cells and DRAM capacitors. The method involves forming a metal shell hard mask around the amorphous mask layer, utilizing refractory metals, and performing anisotropic etch processes to extend openings in the substrate. Overall, the patent outlines a comprehensive approach to semiconductor device fabrication that integrates specific metal layers and mask materials to achieve precise and high-quality results in the manufacturing process.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
