United Microelectronics. has filed a patent for a semiconductor device featuring a high-Q capacitor, ultra high density capacitor, and interconnection on a substrate with trenches. The design aims to improve performance and efficiency in semiconductor applications. GlobalData’s report on United Microelectronics gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on United Microelectronics, Quantum dot devices was a key innovation area identified from patents. United Microelectronics's grant share as of January 2024 was 81%. Grant share is based on the ratio of number of grants to total number of patents.

Semiconductor device with high-q and ultra high density capacitors

Source: United States Patent and Trademark Office (USPTO). Credit: United Microelectronics Corp

The patent application (Publication Number: US20240038832A1) describes a semiconductor device with a unique configuration. The device includes a substrate with at least one trench, a high-Q capacitor on the surface of the substrate, and an ultra-high-density capacitor in the trench. The capacitors consist of electrodes and dielectric layers, with interconnections linking them. Additionally, a barrier layer is present between the substrate surface and the bottom electrode, as well as between the trench inner surface and the first electrode. The device's design allows for efficient use of space and improved performance.

The manufacturing method outlined in the patent involves forming the trench in the substrate, applying barrier and metal layers, and patterning to create the electrodes and interconnections. The process includes steps such as patterning the dielectric layer to remove material between the electrodes and forming an interlayer dielectric layer. By incorporating a complementary metal-oxide-semiconductor process and interlayer dielectric layers, the method ensures the proper functioning of the semiconductor device. Overall, the innovative design and manufacturing process detailed in the patent aim to enhance the performance and efficiency of semiconductor devices.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.