Winbond Electronics saw the highest growth of 130% in patent filings in January and 110% in grants in March in Q1 2024. Compared to Q4 2023, Q1 2024 saw an increase in patent filings by 130% and grants by 51%. GlobalData’s DataBook provides a comprehensive analysis of Winbond Electronics’s patent filings and grants. Buy the databook here.

Winbond Electronics has been focused on protecting inventions in China(CN) with 122 publications in Q1 2024

The China(CN) Patent Office dominates the patent filings and grants with nearly 36% filings and 50% grants. The China(CN), United States(US), World Intellectual Property Organization(WIPO), and Taiwan(TW) patent Office are among the top ten patent offices where Winbond Electronics is filings its patents. Among the top granted patent authorities, Winbond Electronics has 50% of its grants in China(CN), 31% in United States(US) and 13% in Taiwan(TW).

Samsung Group could be the strongest competitor for Winbond Electronics

In terms of grant share, Winbond Electronics stands in seventh position among its competitors. Winbond Electronics and Samsung Group secured the top positions according to recent patent publication data.

Patents related to industrial automation and cybersecurity lead Winbond Electronics's portfolio

Winbond Electronics has the highest number of patents in industrial automation followed by, cybersecurity and climate change. For industrial automation, nearly 28% of patents were filed and 30% of patents were granted in Q1 2024.

Semiconductor products related patents lead Winbond Electronics portfolio followed by integrated circuits, and design & manufacturing

Winbond Electronics has highest number of patents in semiconductor products followed by integrated circuits, design & manufacturing, mos micro (mpu, mcu & dsp), and semiconductors. For semiconductor products, nearly 10% of patents were filed and 11% of patents were granted in Q1 2024.

For comprehensive analysis of Winbond Electronics's filings and grants, buy the databook here.

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