Western Digital has been granted a patent for a method of forming a semiconductor structure involving an alternating stack of material layers, patterning film, and via openings. The process includes anisotropic etching and cladding liner application for precise semiconductor layer formation. GlobalData’s report on Western Digital gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Western Digital, was a key innovation area identified from patents. Western Digital's grant share as of April 2024 was 72%. Grant share is based on the ratio of number of grants to total number of patents.
Method of forming semiconductor structure with alternating stack layers
A recently granted patent (Publication Number: US11972954B2) discloses a method for forming a semiconductor structure involving the creation of an alternating stack of material layers over a semiconductor material layer, followed by the formation of openings through a patterning film. The method includes the use of a cladding liner to extend via openings through the semiconductor material layer, with the liner acting as an etch mask during the process. The cladding liner, made of metallic materials such as Ru, Co, Mo, W, TaN, TiN, or WN, is deposited using processes like physical vapor deposition or atomic layer deposition, ensuring precise control over the structure's formation.
Furthermore, the patent details additional steps in the method, such as the removal of the patterning film layer post-etching and the formation of semiconductor devices and metal interconnect structures. The method also involves the creation of memory opening fill structures and a backside trench through the alternating stack, semiconductor material layer, and sacrificial layers. By selectively etching the sacrificial layer and forming a doped semiconductor source contact layer, the method enables the construction of intricate semiconductor structures with vertical semiconductor channels. Overall, the patent outlines a comprehensive process for fabricating semiconductor structures with precise control over the materials and dimensions involved, showcasing advancements in semiconductor manufacturing techniques.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
