Applied Optoelectronics has patented a replacement lid assembly for RF amplifier housings in HFC networks. The assembly includes a lid body, lid rim with a gasket channel, and integrated power supply. Improved heat transfer fins enhance performance without interrupting CATV services. GlobalData’s report on Applied Optoelectronics gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Applied Optoelectronics, Quantum key distribution was a key innovation area identified from patents. Applied Optoelectronics's grant share as of January 2024 was 63%. Grant share is based on the ratio of number of grants to total number of patents.

Replacement lid assembly for rf amplifier housing in hfc network

Source: United States Patent and Trademark Office (USPTO). Credit: Applied Optoelectronics Inc

A recently granted patent (Publication Number: US11882667B1) discloses a replacement lid assembly designed for an RF amplifier housing in a hybrid fiber-coaxial (HFC) network. The assembly includes a lid body portion with a first lid chamber for housing electronic components, a lid rim with a lid gasket channel, and an integrated power supply in a second lid chamber. Heat transfer fins are also present on the lid body portion to manage heat dissipation effectively. Additionally, the lid gasket is made of silicone and includes both conductive and non-conductive portions for optimal performance.

Moreover, the patent also covers a housing for an electronic device intended for outdoor use, featuring a base with a base chamber and a base gasket channel, along with a lid assembly with similar components as the replacement lid assembly. The lid assembly includes an integrated power supply and heat transfer fins for efficient heat management. The lid gasket, in this case, also includes conductive and non-conductive portions. Furthermore, the patent extends to an RF amplifier for HFC networks, where the lid assembly can be removed without disconnecting the amplifier circuitry, thanks to its design. The amplifier circuitry is capable of amplifying RF signals up to 1.8 GHz and includes connector ports for cable connections, along with a lid gasket with conductive and non-conductive portions for enhanced functionality.

To know more about GlobalData’s detailed insights on Applied Optoelectronics, buy the report here.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.