BE Semiconductor Industries has been granted a patent for a die-ejector designed to facilitate the removal of dies from a carrier. The device features a vacuum chamber, movable plates, a motor-driven drive element, and a magnet system, ensuring efficient operation and precise positioning during the die-ejection process. GlobalData’s report on BE Semiconductor Industries gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on BE Semiconductor Industries, was a key innovation area identified from patents. BE Semiconductor Industries's grant share as of July 2024 was 61%. Grant share is based on the ratio of number of grants to total number of patents.
Die ejector for removing dies from a carrier
The patent US12062566B2 describes a die ejector system designed to facilitate the removal of dies from a carrier. Central to this system is a vacuum chamber that includes a cover plate serving as a supporting surface for the carrier. The die ejector features a series of movable plates within the chamber, which can shift between an initial and an operating position. These plates are equipped with drive recesses that interact with a motor-driven element, allowing for controlled movement. The design incorporates a magnet that exerts an attraction force on the plates, aiding in their movement towards the operating position, while a stop element ensures that the plates remain securely in place when in the operating position.
Further claims detail the structural and functional aspects of the die ejector. The plates are T-shaped, with specific configurations for the drive recesses and stop elements to enhance their operation. The system also includes a camshaft mechanism that orchestrates the movement of the plates in a predetermined order, ensuring efficient die ejection. Additionally, the design allows for the plates to be constructed in multiple parts, enhancing their functionality and interaction with the stop element. The patent outlines various configurations and interactions between components, emphasizing the innovative approach to die ejection technology.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
