Media Summary: The patent granted to MediaTek describes a semiconductor package with a unique land-side silicon capacitor design. The package includes a package substrate, a semiconductor die, conductive elements, and a silicon capacitor with multiple unit dies adjoined with a scribe line region. The capacitor is surrounded by an arrangement of ground and power conductive terminals. GlobalData’s report on MediaTek gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on MediaTek, Adaptive video coding was a key innovation area identified from patents. MediaTek's grant share as of January 2024 was 60%. Grant share is based on the ratio of number of grants to total number of patents.

Semiconductor package with land-side silicon capacitor

Source: United States Patent and Trademark Office (USPTO). Credit: MediaTek Inc

A recently granted patent (Publication Number: US11887976B2) discloses a semiconductor package featuring a package substrate with a semiconductor die mounted on its top surface. The package also includes a land-side silicon capacitor surrounded by conductive elements on the bottom surface of the substrate. The unique aspect of this design is the inclusion of at least two silicon capacitor unit dies adjoined with an integral scribe line region, surrounded by an annular arrangement of conductive terminals. This configuration includes ground conductive terminals near the anode terminals and power conductive terminals near the cathode terminals of the silicon capacitor unit dies.

Furthermore, the patent details various aspects of the semiconductor package, such as the presence of a die seal ring around each silicon capacitor unit die, the use of connecting elements like copper pillars or solder bumps to electrically connect the semiconductor die to the package substrate, and the over-molding of the semiconductor die with an encapsulant. Additionally, the at least two silicon capacitor unit dies are connected in parallel through the package substrate, enhancing the overall functionality of the semiconductor package. The integral scribe line region, with a specific width range of 30-100 micrometers, ensures efficient operation of the land-side silicon capacitor. Each silicon capacitor unit die is equipped with at least two terminals, further contributing to the effectiveness of the semiconductor package.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.