STMicroelectronics had one patents in 3D printing during Q2 2024. The patent describes a semiconductor die mounted on an electrically conductive substrate with an array of leads. An electrically conductive clip bridges the semiconductor die and a lead, with a sculptured distal portion engaging openings in the lead to secure the clip in place. GlobalData’s report on STMicroelectronics gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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STMicroelectronics had no grants in 3D printing as a theme in Q2 2024.
Recent Patents
Application: Method of manufacturing semiconductor devices and corresponding semiconductor device (Patent ID: US20240178179A1)
The patent filed by STMicroelectronics NV describes a method and device for electrically coupling a semiconductor die to an electrically conductive substrate using electrically conductive clips. These clips have a unique design with sculpturing on the distal portion to engage openings in the substrate, immobilizing the clip in a bridge-like position between the die and the conductive lead. The method involves arranging the clips between the die and leads, ensuring proper electrical coupling by soldering the clips, and utilizing additive manufacturing or laser-induced forward transfer processing for sculpturing. Additionally, the patent details a process for mass production of these devices by connecting multiple substrates with sacrificial bars, arranging the clips and dice, and then singulating the substrates to create individual semiconductor devices with exposed clip portions.
The device described in the patent consists of an electrically conductive substrate with an array of leads and notches at the periphery, where semiconductor dies are mounted. The electrically conductive clips are arranged in a bridge-like position between the die and leads, providing electrical coupling. The unique design of the clips includes a planar proximal portion and a distal portion with sculpturing that engages the notches, ensuring immobilization of the clip. The exposed distal portions of the clips at the periphery of the device allow for easy access and connection. The device may also include soldering material for secure electrical connections and an encapsulating body of material to protect the components. Overall, the device offers an efficient and reliable method for electrically coupling semiconductor dies to substrates, enhancing the performance and reliability of electronic devices.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
