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Data Insights
Wolfspeed files patent for packaged electronic device with power semiconductor die and solder joint
Data Insights
Atos files patent for the method to designing firmware with version and rollback data
Data Insights
Soitec files patent for carrier substrate with low particle and defect concentrations
Data Insights
IBIDEN files patent for printed wiring board with layered conductor and electrolytic plating
Data Insights
Renesas Electronics files patent on the system and method for controlling data transactions between master and slave devices
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Data Insights
Swisscom files patent for service policy orchestration in a communication network
Data Insights
Naver files patent on method for changing VOD content to live content during playback
Data Insights
STMicroelectronics files patent for power module with embedded electrical connector
Data Insights
Semiconductor Manufacturing International files patent for miniaturized semiconductor structure with increased conductive sectional area
Data Insights
SerComm files patent on streaming media processing method with metadata for compatibility
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