Disco has been granted a patent for an application apparatus designed to efficiently apply protective tape to semiconductor wafers. The apparatus includes a pressing member with a protective layer outer periphery retainer to press the tape onto the wafer, ensuring precise application. GlobalData’s report on Disco gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Disco, Polishing robots was a key innovation area identified from patents. Disco's grant share as of April 2024 was 50%. Grant share is based on the ratio of number of grants to total number of patents.
Protective tape application apparatus for semiconductor wafer
A recently granted patent (Publication Number: US11935768B2) discloses an application apparatus designed for applying a protective tape to a semiconductor wafer. The apparatus includes an application table to support the wafer and a pressing member to press the protective tape onto the wafer. The pressing member consists of a first holder and a protective layer outer periphery retainer, which facilitates the application of the protective tape by pressing its peripheral portion towards the semiconductor wafer. The design ensures that there is a gap between the first holder and the protective layer during the application process, allowing for precise application without damaging the wafer.
Furthermore, the application apparatus features a unique arrangement where the application table is located in a lower chamber that can be raised and lowered, while the pressing member is situated in an upper chamber forming a vacuum chamber with the lower chamber. This setup allows the pressing member to move up and down, ensuring efficient application of the protective tape. Additionally, the apparatus includes a frame base to support a dicing frame on which the wafer is mounted, along with a tape outer periphery retainer to press the protective tape onto the dicing frame. The method of using this application apparatus involves steps such as supplying the protective tape onto the wafer and applying it by pressing the peripheral portion of the protective layer towards the wafer, ensuring secure adhesion. Additional steps include pressing the protective tape onto the dicing frame and heating the wafer, enhancing the overall protective tape application process.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
