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FormFactor. has filed a patent for improved attenuated testing performance by moving attenuation components to the space transformer of the probe head. This method reduces electrical path lengths, enhancing performance, especially in loopback testing. The patent claims a method involving temporary electrical contact between the probe head and the device under test, utilizing resistive components on the space transformer for attenuation during testing. GlobalData’s report on FormFactor gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on FormFactor, Under-screen biometric identification was a key innovation area identified from patents. FormFactor's grant share as of January 2024 was 56%. Grant share is based on the ratio of number of grants to total number of patents.

Improved performance for attenuated testing during probe testing

Source: United States Patent and Trademark Office (USPTO). Credit: FormFactor Inc

The patent application (Publication Number: US20230393174A1) describes a method for providing a specified attenuation for probe testing. The method involves making temporary electrical contact between a probe head and a device under test, followed by performing electrical testing using the probe head. The probe head includes a space transformer with a first side in contact with test equipment and a second side in direct contact with a probe array. The electrical testing includes utilizing resistive components on the space transformer to provide attenuation for the testing.

Furthermore, the method allows for the alteration of the fixed attenuation value by changing the resistive components, and it can involve differential or single-ended attenuation of signal paths. The frequency range for the electrical testing is specified between 0.1 GHz to 120 GHz. The design of the resistive components takes into account various process parameters such as placement accuracy and contact pad sizes. The method is applicable for testing devices like wafers using vertical probe arrays and surface mount technology components for resistive elements. Additionally, the testing can involve signal transmission and loopback tests with attenuation provided by the resistive components on the space transformer.

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